LK-F Series CMOS Laser Displacement Sensor

The DAIDISIKE LK-F series CMOS laser displacement sensor offers high-precision, non-contact measurement for industrial automation. Using laser triangulation, it achieves micron-level accuracy for displacement, thickness and surface-profile measurement on various materials. Available in short (30 – 100 mm), mid (200 mm) and long-range (400 mm) models, with high repeatability, low linearity error and strong anti-interference performance.

CMOS triangulation30 / 50 / 100 / 200 / 400 mm10 μm repeatabilityNPN / PNP outputsIP67 aluminum housing655 nm Class 2 laser
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Product Description

The DAIDISIKE LK-F series CMOS laser displacement sensor is a high-precision, non-contact measurement device designed for industrial automation, precision manufacturing and quality control. It employs advanced CMOS imaging technology for micron-level displacement measurements, with models covering short-range (30 mm – 100 mm), mid-range (200 mm), and long-range (400 mm) detection distances. The sensor uses the laser-triangulation principle to deliver stable and reliable displacement, thickness, vibration and surface-profile detection across a wide range of materials including metal, plastic and glass. The product features high repeatability, low linearity error, strong anti-interference capability, and supports NPN / PNP output modes compatible with multiple industrial protocols.

The series light source is a red visible laser (~655 nm wavelength, < 1 mW output), compliant with Class 2 laser product safety standards. The housing is made of robust aluminum alloy with an IP67 protection rating; operating temperature range is −10 °C to +50 °C, suitable for harsh industrial environments — automotive manufacturing, electronics assembly, semiconductor processing and similar.

Specifications Table — 16 Models

TypeOutputModelDetection DistanceOutput MethodRepeatabilityLinearity Accuracy
Short-rangeNPNLK-F30MN30 ± 5 mmDual Output (Analog + Switching)10 μm0.01 mm
PNPLK-F30MP30 ± 5 mmDual Output (Analog + Switching)10 μm0.01 mm
NPNLK-F50MN50 ± 15 mmDual Output (Analog + Switching)50 μm0.03 mm
PNPLK-F50MP50 ± 15 mmDual Output (Analog + Switching)50 μm0.03 mm
Mid-rangeNPNLK-F100N100 ± 35 mmSwitching Output100 μm0.1 mm
PNPLK-F100P100 ± 35 mmSwitching Output100 μm0.1 mm
NPNLK-F100MN100 ± 35 mmDual Output (Analog + Switching)100 μm0.1 mm
PNPLK-F100MP100 ± 35 mmDual Output (Analog + Switching)100 μm0.1 mm
NPNLK-F200N200 ± 80 mmSwitching Output200 μm0.2 mm
PNPLK-F200P200 ± 80 mmSwitching Output200 μm0.2 mm
NPNLK-F200MN200 ± 80 mmDual Output (Analog + Switching)200 μm0.2 mm
PNPLK-F200MP200 ± 80 mmDual Output (Analog + Switching)200 μm0.2 mm
Long-rangeNPNLK-F400N400 ± 200 mmSwitching Output400 μm / 800 μm0.8 mm
PNPLK-F400P400 ± 200 mmSwitching Output400 μm / 800 μm0.8 mm
NPNLK-F400MN400 ± 200 mmDual Output (Analog + Switching)400 μm / 800 μm0.8 mm
PNPLK-F400MP400 ± 200 mmDual Output (Analog + Switching)400 μm / 800 μm0.8 mm

Additional Specifications

Technical Parameters

The LK-F series focuses on high-precision measurement with multi-mode operation — displacement detection, thickness measurement and surface scanning. Sensor resolution reaches 0.01 μm (typical), sampling rate up to 1 kHz, supporting external triggering for synchronized measurements. Linearity accuracy is ± 0.03 % F.S., repeatability ± 0.01 % F.S., and the temperature drift coefficient is less than 0.01 % / °C.

The product integrates a digital signal processor (DSP) for real-time compensation of ambient-light interference and surface-reflectance changes. Laser safety complies with IEC 60825-1; electromagnetic compatibility (EMC) is CE-certified. RS-232 or Ethernet communication is supported as an option, with data output in ASCII or binary formats. Power consumption is as low as 300 mW, suitable for battery-powered devices. Advanced features include adaptive light-intensity adjustment, multi-point calibration, and anomaly-alarm output.

Working Principle

The DAIDISIKE LK-F series uses laser-triangulation technique, an optical non-contact measurement method widely used in precision industrial applications. A semiconductor laser diode emits a visible red beam (≈ 655 nm), focused through a collimating lens into a small spot projected onto the target object. The beam undergoes diffuse or specular reflection on the surface, and the reflected light is imaged through a receiving lens onto a linear CMOS image sensor — a high-resolution pixel array that detects the centre position of the spot.

According to the triangulation principle, the sensor calculates the geometric relationship of the triangle formed by the emitted beam, the reflected beam and the object surface. The distance is given by d = (f × b) / (x′ − x₀), where f is the focal length of the receiving lens, b the baseline distance between transmitter and receiver, x′ the imaging position of the spot on the CMOS, and x₀ the reference position. A built-in ADC and microcontroller process the pixel data in real time and convert it into a displacement value. This process is unaffected by target colour or texture (under compensation algorithms), reaching sub-micron resolution.

The sensor also integrates a photodiode for laser- intensity monitoring, enabling automatic power control (APC) to maintain stability. The entire measurement cycle has a response time of less than 1 ms, supporting high-speed dynamic measurement suitable for vibration analysis or in-line inspection. Compared with capacitive or eddy-current sensors, the laser-triangulation method offers a longer measurement range and higher accuracy — keep the surface tilt angle within ± 10° to avoid measurement errors.